Precise BGA Rework Tools
Features: ●Motherboard repair tools demolition chip artifact. Such as remove A9 A8 CPU. ●Ultra-thin blade, capricious good, it can ease between the chip and the board at the end, is not easy to lead off point. Material: Metal Common problem instructions: 1.To clea..
$2.99
Ex Tax:$2.99
Features: Professional repair tool set for iPhone CPU disassemble For BGA repair,dismantling phone CPU chip and phone repair It can be used to separate the welding spot One handle and 8 pcs blades in different shape The ultra thin blade is made of alloy steel, which is go..
$5.35
Ex Tax:$5.35
Features:-The solder wire is inseparable from the quality of the solder wire, and the quality problem will affect the chemical, mechanical and physical properties of the solder wire. -Full net weight -Contains flux rosin for better welding results -Medium temperature melting point, widely used in mo..
$3.25
Ex Tax:$3.25
Features: Durable. Precision. Rust. Antimagnetic corrosion. Tough and Hand Polished. Package Included:1 x RELIFE RT-11A Jump Eire Special Tweezer Detail Pictures:..
$11.42
Ex Tax:$11.42
Features: 3D laser square hole BGA reballing stencil template. High-speed numerical control technology and high-temperature resistant toughened materials production,round square precise hole posttion,make steel net more durable,easier to take off the net,more efficient. New patented phone X Mid..
$7.93
Ex Tax:$7.93
Features: 3D laser square hole BGA reballing stencil template. High-speed numerical control technology and high-temperature resistant toughened materials production,round square precise hole posttion,make steel net more durable,easier to take off the net,more efficient. New patented phone X Mid..
$8.63
Ex Tax:$8.63
Features: 3D laser square hole BGA reballing stencil template. High-speed numerical control technology and high-temperature resistant toughened materials production,round square precise hole posttion,make steel net more durable,easier to take off the net,more efficient. New patented iphone X Mi..
$8.76
Ex Tax:$8.76
Features: 1. Adopting non-copper imported materials, Germany's advanced RUI-SRO winding technology, featuring high efficiency, high anti-interference, low inductance and superplastic extension. 2. Using environmentally friendly vacuum bag packaging with desiccant. 3. The scope of application: Apple ..
$2.99
Ex Tax:$2.99
Features: High density, high impedance Pure alloy compositin Fine and sticky Stannum planting, not bubbing Silver containing highlight Model: SP-X Weight: 50g Size: 38 x 31 x 35mm Melting Point: 158℃Package Included:1 x SP-X Middle Layer of BGA Motherboard Special Solder Paste Detai..
$9.63
Ex Tax:$9.63
Features: 1. Suit for iPhone 6/6 Plus/6S/6S Plus/7/7 Plus/8/8 Plus/X, package includes a base pad and 9pcs chart to help you quickly set the screw 2. Strong magnetic positioning, not easy to fall. 3. All in one design,easy to store. 4. It has screw and part location,you can..
$8.30
Ex Tax:$8.30
Specification: Model Number: SS-101A DIY Supplies: Electrical Application: Computer Tool Kit Function: PCB Repair Weight: About 28g Use: BGA IC Chip Handle Material: Stainless Steel Blade Material: Stainless Steel Size: 12cm x 5cm x 6 x cm Package includes: 1 x SS-10..
$6.17
Ex Tax:$6.17
Feature: 1. Scraper: suitable for all edge rubber processing with plastic IC, does not hurt the motherboard; 2. Sickle: suitable for disassembly of WIFI, hard disk and other sealing IC; 3. Blade: For A8 A9 A10 CPU layering and integrated disassembly; 4. Hand-polished, sharp and tough, each blade i..
$13.39
Ex Tax:$13.39